Research of coupling coefficient extraction of a cavity resonator

Wang, X.F.;   Shi, Z.G.;   Chen, K.S.;

Dept. of Inf. & Electron. Eng., Zhejiang Univ., Hangzhou, China

This paper appears in: Microwave Conference Proceedings (CJMW), 2011 China-Japan Joint
Issue Date: 20-22 April 2011
On page(s): 1 – 4
Location: Hangzhou
Print ISBN: 978-1-4577-0625-7
INSPEC Accession Number: 12031043
Date of Current Version: 27 五月 2011


The electromagnetic coupling coefficient is an important parameter in circuit modeling and simulation because it characterizes the transducer and useful for deducing equivalent circuits. In this paper, we proposed a numeric coupling coefficient extraction method based on perturbation theory and commercially available CST software of solving the coupling coefficient of the rectangular waveguide resonator, which is coupling with a coaxial cable. Simulation results indicate that this method is consistent with the theoretical method, and it is commonly used for rectangular or cylindrical cavities. Thus, the proposed method could offer an effective way of solving coupling coefficients extraction problem for cavity resonators.

Download: Revised-Research_of_solving_coupling_coefficient_of_cavity_resonator

Novel Millimeter Wave Power-Combining System In 3-D Packaging Level

Author:Xianfeng Wang, Zhiguo Shi, Kangsheng Chen


This paper presents a novel millimeter wave power- combining system which can be fabricated with modern packaging technology and compatible with CMOS process. The system is comprised of a silicon integrated waveguide (SIW) resonator coupled with numerous λ/4 standing wave resonators, all of which can be fabricated by using via holes in 3-D packaging level. The coupling between the SIW resonator and the λ/4 standing wave resonators can be fabricated by eroding slots in the metal layer. An example system operating at 77GHz is illustrated and simulation results of electromagnetic field distribution in the SIW resonator and around the λ/4 standing wave resonators from professional electromagnetic simulation tool are presented. It is shown that the resonant frequency and phase of these λ/4 standing wave resonators are controlled by the SIW resonator and the power of all these λ/4 standing wave resonators can be combined in the SIW resonator. The SIW resonator operates in TE102 mode and has a quality factor of more than 500, which is much higher than that of each independent λ/4 standing wave resonators with quality factor of about 150. Thus the proposed power-combining system fabricated in packaging level can work effectively and features a lower loss and high quality factor.

download the pdf.[IEEE—ICEPT—Novel Millimeter Wave Power-Combining System In 3-D Packaging Level]

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging 733 978-1-4244-8142-2/10/$26.00 ©2010 IEEE

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